The TestStand Semiconductor Module™ (TSM) extends the TestStand environment to help you develop, debug, deploy, and maintain semiconductor test systems. It helps you develop and maintain semiconductor systems, including wafer-level and final package test applications, with pin/channel mapping, binning, handler/prober drivers, limit importing/exporting, and multisite programming.

• Multisite pin map file, TSM Code Module APIs, and Semiconductor Multi Test step type for developing a semiconductor test program that runs on multiple test system hardware configurations with a variable number of test sites at a high parallel test efficiency.
• Support for binning devices under test (DUTs) based on test results.
• Support for exporting and importing test limits with text files.
• Data types, configurable callbacks, and dialog boxes for specifying test program settings, test station settings, and test lot information.
• Plug-in architecture for handler and prober communication using TSM handler/prober drivers.
• Result processing plug-ins for generating report and data log files for the test lot, such as Standard Test Data Format (STDF) log file.
• Plug-in architecture for performing part average testing.
• Customizable operator interface for executing test programs, enabling or disabling test sites, displaying statistics, and configuring test lot information and test station settings.
• A set of step types with template code to perform common operations, such as setting up and closing instruments, powering up a DUT, or executing common tests.
• Customizable pin- and site-aware instrument panel VIs for debugging instruments during test program execution at a breakpoint.