PXIe-5644 Specifications

Definitions

Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

  • Typical specifications describe the performance met by a majority of models.
  • Typical-95 specifications describe the performance met by 95% (≈2σ) of models with a 95% confidence.
  • Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.

Specifications are Warranted unless otherwise noted.

Conditions

Specifications are valid under the following conditions unless otherwise noted.

  • 30 minutes warm-up time.
  • Calibration cycle is maintained.
  • Chassis fan speed is set to High. In addition, NI recommends using slot blockers and EMC filler panels in empty module slots to minimize temperature drift.
  • Calibration IP is used properly during the creation of custom FPGA bitfiles.
  • Calibration Interconnect cable remains connected between CAL IN and CAL OUT front panel connectors.
  • The cable connecting CAL IN to CAL OUT has not been removed or tampered with.
  • Reference Clock source: Internal
  • RF IN reference level: 0 dBm
  • RF OUT power level: 0 dBm
  • LO tuning mode: Fractional
  • LO PLL loop bandwidth: Medium
  • LO step size: 200 kHz
  • LO frequency: 2.4 GHz
  • LO source: Internal

Frequency

The following characteristics are common to both RF IN and RF OUT ports.

Frequency range

65 MHz to 6 GHz

Bandwidth[1]

80 MHz

Tuning resolution[2]

<1 Hz

LO step size

Fractional mode

Programmable step size, 200 kHz default

Integer mode

4 MHz, 5 MHz, 6 MHz, 12 MHz, 24 MHz

Frequency Settling Time

Table 1. Maximum Frequency Settling Time
Settling Time Maximum Time (ms)
Low Loop Bandwidth Medium Loop Bandwidth[3] (default) High Loop Bandwidth
≤1 × 10-6 of final frequency 1.1 0.95 0.38
≤0.1 × 10-6 of final frequency 1.2 1.05 0.4

The default medium loop bandwidth refers to a setting that adjusts PLL to balance tuning speed and phase noise, and it does not necessarily result in loop bandwidth between low and high.

This specification includes only frequency settling and excludes any residual amplitude settling.

Internal Frequency Reference

Initial adjustment accuracy

±200 × 10 -9

Temperature stability

±1 × 10 -6, maximum

Aging

±1 × 10 -6 per year, maximum

Accuracy

Initial adjustment accuracy ± Aging ± Temperature stability

Frequency Reference Input (REF IN)

Refer to the REF IN section.

Frequency Reference/Sample Clock Output (REF OUT)

Refer to the REF OUT section.

Spectral Purity

Table 2. Single Sideband Phase Noise
Frequency Phase Noise (dBc/Hz), 20 kHz Offset (Single Sideband)
Low Loop Bandwidth Medium Loop Bandwidth High Loop Bandwidth
<3 GHz -99 -99 -94
3 GHz to 4 GHz -91 -93 -91
>4 GHz to 6 GHz -93 -93 -87
Figure 1. Measured Phase Noise[4] at 1 GHz, 2.4 GHz, and 5.8 GHz

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Figure 2. Measured Phase Noise[5] at 2.4 GHz Versus Loop Bandwidth

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RF Input

Amplitude Range

Amplitude range

Average noise level to +30 dBm (CW RMS)

RF reference level range/resolution

≥60 dB in 1 dB nominal steps

Amplitude Settling Time

<0.1 dB of final value[6]

125 μs, typical

<0.5 dB of final value[7], with LO retuned

300 μs

Absolute Amplitude Accuracy

Table 3. VSA Absolute Amplitude Accuracy (dB)
Center Frequency 15 °C to 35 °C 0 °C to 55 °C
Self-Calibration °C ± 1 °C Self-Calibration °C ± 5 °C Self-Calibration °C ± 1 °C Self-Calibration °C ± 5 °C
65 MHz to <375 MHz — ±0.70 — ±0.75
— ±0.65 (95th percentile, ≈ 2σ) — ±0.65 (95th percentile, ≈ 2σ)
±0.34, typical ±0.50, typical ±0.36, typical ±0.55, typical
375 MHz to <2 GHz — ±0.65 — ±0.70
— ±0.55 (95th percentile, ≈ 2σ) — ±0.55 (95th percentile, ≈ 2σ)
±0.17, typical ±0.35, typical ±0.22, typical ±0.40, typical
2 GHz to <4 GHz — ±0.70 — ±0.75
— ±0.55 (95th percentile, ≈ 2σ) — ±0.60 (95th percentile, ≈ 2σ)
±0.23, typical ±0.40, typical ±0.26, typical ±0.40, typical
4 GHz to 6 GHz — ±0.90 — ±0.95
— ±0.75 (95th percentile, ≈ 2σ) — ±0.80 (95th percentile, ≈ 2σ)
±0.30, typical ±0.55, typical ±0.33, typical ±0.55, typical

Conditions: Reference level -30 dBm to +30 dBm; measured at 3.75 MHz offset from the configured center frequency; measurement performed after the PXIe-5644 has settled.

For reference levels <-30 dBm, absolute amplitude gain accuracy is ±0.6 dB, typical for frequencies ≤ 4 GHz, and ±0.8 dB, typical for frequencies > 4 GHz. Performance depends on signal-to-noise ratio.

This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

Frequency Response

Table 4. VSA Frequency Response (dB) (Amplitude, Equalized)
RF Input Frequency Bandwidth Self-Calibration °C ± 5 °C
≤109 MHz 20 MHz ±1.0, typical
>109 MHz to 375 MHz 20 MHz ±0.5
40 MHz ±1.0, typical
>375 MHz to 6 GHz 80 MHz ±0.5
Conditions: Reference level -30 dBm to +30 dBm. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.
Figure 3. Measured Frequency Response,[8]0 dBm Reference Level, Equalized

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Figure 4. Measured Frequency Response,[8]-30 dBm Reference Level, Equalized

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Average Noise Density

Table 5. Average Noise Density (dBm/Hz)
Center Frequency Average Noise Level
-50 dBm Reference Level -10 dBm Reference Level
65 MHz to 4 GHz -159 -145
-161, typical -148, typical
>4 GHz to 6 GHz -156 -144
-158, typical -146, typical

Conditions: Input terminated with a 50 Ω load; 50 averages; RMS average noise level normalized to a 1 Hz noise bandwidth.

The -50 dBm reference level configuration has the inline preamplifier enabled, which represents the high sensitivity operation of the receive path.

Spurious Responses

Nonharmonic Spurs

Table 6. Nonharmonic Spurs (dBc)
Frequency <100 kHz Offset ≥100 kHz Offset >1 MHz Offset
65 MHz to 3 GHz <-55, typical <-60 <-75
>3 GHz to 6 GHz <-55, typical <-55 <-70
Conditions: Reference level ≥-30 dBm. Measured with a single tone, -1 dBr, where dBr is referenced to the configured RF reference level.

LO Residual Power

Table 7. VSA LO Residual Power (dBr[9])
Center Frequency Self-Calibration °C ± 1 °C Self-Calibration °C ± 5 °C
≤109 MHz — -62
-67, typical -67, typical
>109 MHz to 375 MHz — -58
-65, typical -61, typical
>375 MHz to 1.5 GHz — -53
-58, typical -56, typical
>1.5 GHz to 2 GHz — -47
-58, typical -54, typical
>2 GHz to 3 GHz — -52
-58, typical -56, typical
>3 GHz to 4 GHz — -44
-49, typical -47, typical
>4 GHz to 6 GHz — -43
-48, typical -46, typical

Conditions: Reference levels -30 dBm to +30 dBm; Measured at ADC.

This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

For optimal performance, NI recommends running self-calibration when the PXIe-5644 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >±5 °C from self-calibration, LO residual power is -35 dBr.

Figure 5. VSA LO Residual Power,[10] Typical

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Residual Sideband Image

Table 8. VSA Residual Sideband Image, 80 MHz Bandwidth (dBc)
Center Frequency Self-Calibration °C ± 1 °C Self-Calibration °C ± 5 °C
≤109 MHz — -40
-60, typical -50, typical
>109 MHz to 500 MHz — -40
-50, typical -45, typical
>500 MHz to 3 GHz — -65
-75, typical -70, typical
>3 GHz to 5 GHz — -55
-70, typical -60, typical
>5 GHz to 6 GHz — -60
-70, typical -65, typical

Conditions: Reference levels -30 dBm to +30 dBm.

This specification describes the maximum residual sideband image within an 80 MHz bandwidth at a given RF center frequency. Bandwidth is restricted to 20 MHz for LO frequencies ≤ 109 MHz.

This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

For optimal performance, NI recommends running self-calibration when the PXIe-5644 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, residual image suppression is -40 dBc.

Figure 6. VSA Residual Sideband Image,[11] 0 dBm Reference Level, Typical

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Figure 7. VSA Residual Sideband Image,[11] -30 dBm Reference Level, Typical

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Third-Order Input Intermodulation

Table 9. Third-Order Input Intercept Point (IIP3), -5 dBm Reference Level, Typical
Frequency Range IIP3 (dBm)
65 MHz to 1.5 GHz 19
>1.5 GHz to 6 GHz 20

Conditions: Two -10 dBm tones, 700 kHz apart at RF IN; reference level: -5 dBm<4 GHz, -2 dBm reference level otherwise; nominal noise floor: -148 dBm/Hz for -5 dBm reference level, -145 dBm/Hz for -2 dBm reference level.

Table 10. Third-Order Input Intercept Point (IIP3), -20 dBm Reference Level, Typical
Frequency Range IIP3 (dBm)
65 MHz to 200 MHz 9
>200 MHz to 2 GHz 11
>2 GHz to 3.75 GHz 8
>3.75 GHz to 4.25 GHz 6
>4.25 GHz to 5 GHz 4
>5 GHz to 6 GHz 1

Conditions: Two -25 dBm tones, 700 kHz apart at RF IN; reference level: -20 dBm; nominal noise floor: -157 dBm/Hz.

Second-Order Input Intermodulation

Table 11. Second-Order Input Intercept Point (IIP2), -2 dBm Reference Level, Typical[12]
Frequency Range IIP2 (dBm)
65 MHz to 1.5 GHz 67
>1.5 GHz to 4 GHz 58
>4 GHz to 6 GHz 52

RF Output

Power Range

Table 12. Power Range
Output Type Frequency Power Range
CW <4 GHz Noise floor to +10 dBm, average power[13] Noise floor to +15 dBm, average power, nominal
≥4 GHz Noise floor to +7 dBm, average power[13] Noise floor to +12 dBm, average power, nominal
Modulated[14] <4 GHz Noise floor to +6 dBm, average power —
≥4 GHz Noise floor to +3 dBm, average power —

Output attenuator resolution

2 dB, nominal

Digital attenuation resolution[15]

0.1 dB or better

Amplitude Settling Time

0.1 dB of final value[16]

50 μs

0.5 dB of final value[17], with LO retuned

300 μs

Output Power Level Accuracy

Table 13. Output Power Level Accuracy (dB)
Center Frequency 15 °C to 35 °C 0 °C to 55 °C
Self-Calibration°C ± 1 °C Self-Calibration°C ± 5 °C Self-Calibration°C ± 1 °C Self-Calibration°C ± 5 °C
65 MHz to <109 MHz — ±0.70 — ±0.90
— ±0.55 (95th percentile, ≈ 2σ) — ±0.65 (95th percentile, ≈ 2σ)
±0.26, typical ±0.40, typical ±0.36, typical ±0.50, typical
109 MHz to <270 MHz[18] ±0.26, typical ±0.75 ±0.36, typical ±0.90
±0.60 (95th percentile; ≈ 2σ) ±0.70 (95th percentile; ≈ 2σ)
±0.45, typical ±0.55, typical
270 MHz to <375 MHz — ±0.70 — ±0.90
— ±0.55 (95th percentile, ≈ 2σ) — ±0.65 (95th percentile, ≈ 2σ)
±0.26, typical ±0.40, typical ±0.36, typical ±0.50, typical
375 MHz to <2 GHz — ±0.75 — ±0.90
— ±0.55 (95th percentile, ≈ 2σ) — ±0.65 (95th percentile, ≈ 2σ)
±0.26, typical ±0.40, typical ±0.36, typical ±0.50, typical
2 GHz to <4 GHz — ±0.75 — ±0.90
— ±0.60 (95th percentile, ≈ 2σ) — ±0.70 (95th percentile, ≈ 2σ)
±0.26, typical ±0.40, typical ±0.36, typical ±0.50, typical
4 GHz to 6 GHz — ±1.00 — ±1.15
— ±0.80 (95th percentile, ≈ 2σ) — ±0.90 (95th percentile, ≈ 2σ)
±0.28, typical ±0.40, typical ±0.38, typical ±0.60, typical

Conditions: CW average power -70 dBm to +10 dBm.

For power <-70 dBm, highly accurate generation can be achieved using digital attenuation, which relies on DAC linearity.

The absolute amplitude accuracy is measured at 3.75 MHz offset from the configured center frequency. The absolute amplitude accuracy measurements are made after the PXIe-5644 has settled.

This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

Figure 8. Relative Power Accuracy, -40 dBm to 10 dBm, 10 dB Steps, Typical

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Frequency Response

Table 14. VSG Frequency Response (dB) (Amplitude, Equalized)
Output Frequency Bandwidth Self-Calibration °C ± 5 °C
≤109 MHz 20 MHz ±1.0, typical
>109 MHz to 375 MHz 20 MHz ±0.5
40 MHz ±1.0, typical
>375 MHz to 6 GHz 80 MHz ±0.5
For this specification, frequency refers to the RF output frequency. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.
Figure 9. VSG Measured Frequency Response[19]

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Output Noise Density

Table 15. Average Output Noise Level (dBm/Hz)
Center Frequency Power Setting
-30 dBm 0 dBm 10 dBm
65 MHz to 500 MHz — — -136
-168, typical -150 , typical -140, typical
>500 MHz to 2.5 GHz -168, typical -150 -141
>2.5 GHz to 3.5GHz -168, typical -149 -139
>3.5 GHz to 6 GHz -165, typical -147 -136
Conditions: Averages: 200 sweeps; baseband signal attenuation: -40 dB; noise measurement frequency offset: 4 MHz relative to output tone frequency.

Spurious Responses

Harmonics

Table 16. Second Harmonic Level (dBc)
Fundamental Frequency 23 °C ± 5 °C 0 °C to 55 °C
65 MHz to 3.5 GHz

-27

-24.8

-29.5, typical

-27.2, typical

>3.5 GHz to 4.5 GHz

-26.3

-24

-28.9, typical

-26.6, typical

>4.5 GHz to 6 GHz

-28.9

-26.6

-33.3, typical

-31, typical

Conditions: Measured using 1 MHz baseband signal -1 dBFS; fundamental signal measured at +6 dBm CW; second harmonic levels nominally <-30 dBc for fundamental output levels of ≤5 dBm.
Note Higher order harmonic suppression is degraded in the range of 109 MHz to 270 MHz, and third harmonic performance is shown in the following figure. For frequencies outside the range of 109 MHz to 270 MHz, higher order harmonic distortion is equal to or better than the second harmonic level as specified in the previous table.
Figure 10. Harmonic Level,[20]65 MHz to 500 MHz, Measured

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Nonharmonic Spurs

Table 17. Nonharmonic Spurs (dBc)
Frequency <100 kHz Offset ≥100 kHz Offset >1 MHz Offset
65 MHz to 3 GHz <-55, typical <-62 <-75
>3 GHz to 6 GHz <-55, typical <-57 <-70
Conditions: Output full scale level ≥-30 dBm. Measured with a single tone at -1 dBFS.

Third-Order Output Intermodulation

Table 18. Third-Order Output Intermodulation Distortion (IMD3) (dBc), 0 dBm Tones
Fundamental Frequency Baseband DAC: -2 dBFS Baseband DAC: -6 dBFS
65 MHz to 1 GHz

-55, typical

-60, typical

>1 GHz to 3 GHz

-53, typical

-53, typical

>3 GHz to 5 GHz

-49, typical

-50, typical

>5 GHz to 6 GHz

-44, typical

-45, typical

Conditions: Two 0 dBm tones, 500 kHz apart at RF OUT.

RF gain applied to achieve the desired output power per tone.

Table 19. Third-Order Output Intermodulation Distortion (IMD3) (dBc), -6 dBm Tones
Fundamental Frequency Baseband DAC: -2 dBFS Baseband DAC: -6 dBFS
65 MHz to 1.5 GHz

-50

-59

-54, typical

-62, typical

>1.5 GHz to 3.5 GHz

-54

-59

-57, typical

-62, typical

>3.5 GHz to 5 GHz

-50

-55

-53, typical

-58, typical

>5 GHz to 6 GHz

-47

-51

-50, typical

-54, typical

Conditions: Two -6 dBm tones, 500 kHz apart at RF OUT.

RF gain applied to achieve the desired output power per tone.

Table 20. Third-Order Output Intermodulation Distortion (IMD3) (dBc), -36 dBm Tones
Fundamental Frequency Baseband DAC: -2 dBFS Baseband DAC: -6 dBFS
65 MHz to 200 MHz

-52

-57

-54, typical

-60, typical

>200 MHz to 6 GHz

-52

-55

-54, typical

-58, typical

Conditions: Two -36 dBm tones, 500 kHz apart at RF OUT.

RF gain applied to achieve the desired output power per tone.

LO Residual Power

Table 21. VSG LO Residual Power (dBc)
Center Frequency Self-Calibration °C ± 1 °C Self-Calibration °C ± 5 °C
≤109 MHz — -50
-57, typical -55, typical
>109 MHz to 375 MHz — -42
-47, typical -45, typical
>375 MHz to 1.6 GHz — -55
-62, typical -60, typical
1.6 GHz to 2 GHz — -54
-60, typical -58, typical
2 GHz to 3 GHz — -47
-53, typical -51, typical
3 GHz to 4 GHz — -52
-57, typical -55, typical
4 GHz to 5 GHz — -51
-60, typical -56, typical
5 GHz to 6 GHz — -47
-56, typical -52, typical

Conditions: Configured power levels -50 dBm to +10 dBm.

This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

For optimal performance, NI recommends running self-calibration when the PXIe-5644 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, LO residual power is -40 dBc.

Figure 11. VSG LO Residual Power,[21]109 MHz to 6 GHz, Typical

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Table 22. VSG LO Residual Power (dBc), Low Power
Center Frequency Self-Calibration °C ± 5 °C
≤109 MHz —
-49, typical
>109 MHz to 375 MHz -45
-50, typical
>375 MHz to 2 GHz -55
-60, typical
>2 GHz to 3 GHz -50
-53, typical
>3 GHz to 4 GHz -55
-58, typical
>4 GHz to 5 GHz —
-40, typical
>5 GHz to 6 GHz -43
-45, typical

Conditions: Configured power levels < -50 dBm to -70 dBm.

This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

For optimal performance, NI recommends running self-calibration when the PXIe-5644 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, LO residual power is -40 dBc.

Residual Sideband Image

Table 23. VSG Residual Sideband Image (dBc), 80 MHz Bandwidth
Center Frequency Self-Calibration °C ± 1 °C Self-Calibration °C ± 5 °C
≤109 MHz — -40
-55, typical -45, typical
>109 MHz to 375 MHz — —
-45, typical -40, typical
>375 MHz to 2 GHz — -60
-70, typical -65, typical
>2 GHz to 4 GHz — -50
-65, typical -55, typical
>4 GHz to 6 GHz — -40
-70, typical -50, typical

Conditions: Configured power levels -50 dBm to +10 dBm.

This specification describes the maximum residual sideband image within an 80 MHz bandwidth at a given RF center frequency. Bandwidth is restricted to 20 MHz for LO frequencies ≤ 109 MHz.

This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

For optimal performance, NI recommends running self-calibration when the PXIe-5644 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, residual image suppression is -40 dBc.

Figure 12. VSG Residual Sideband Image,[22] 0 dBm Average Output Power, Typical

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Figure 13. VSG Residual Sideband Image,[22] -30 dBm Average Output Power, Typical

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Error Vector Magnitude (EVM)

VSA EVM

20 MHz bandwidth 64-QAM EVM[23]375 MHz to 6 GHz

-40 dB, typical

Figure 14. VSA Error Vector Magnitude, Typical[24]

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VSG EVM

20 MHz bandwidth 64-QAM EVM[25]375 MHz to 6 GHz

-40 dB, typical

Figure 15. RMS EVM (dB) versus Measured Average Power (dBm), Typical [26]

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Application-Specific Modulation Quality

Typical performance assumes the PXIe-5644 is operating within ± 5 °C of the previous self-calibration temperature, and that the ambient temperature is 0 °C to 55 °C.

WLAN 802.11ac

OFDM[27]

-45 EVM (rms) dB, typical

WLAN 802.11n

Table 24. 802.11n OFDM EVM (rms) (dB), Typical
Frequency 20 MHz Bandwidth 40 MHz Bandwidth
2,412 MHz -50 -50
5,000 MHz -48 -46
Conditions: RF OUT loopback to RF IN; average power: -10 dBm; reference level: auto-leveled based on real-time average power measurement; 20 packets; 3/4 coding rate; 64 QAM.

WLAN 802.11a/g/j/p

Table 25. 802.11a/g/j/p OFDM EVM (rms) (dB), Typical
Frequency 20 MHz Bandwidth
2,412 MHz -53
5,000 MHz -50
Conditions: RF OUT loopback to RF IN; average power: -10 dBm; reference level: auto-leveled based on real-time average power measurement; 20 packets; 3/4 coding rate; 64 QAM.

WLAN 802.11g

Table 26. 802.11g DSSS-OFDM EVM (rms) (dB), Typical
Frequency 20 MHz Bandwidth
2,412 MHz -53
5,000 MHz -50
Conditions: RF OUT loopback to RF IN; average power: -10 dBm; reference level: auto-leveled based on real-time average power measurement; 20 packets; 3/4 coding rate; 64 QAM.

WLAN 802.11b/g

DSSS[28]

-48 EVM (rms) dB, typical

LTE

Table 27. SC-FDMA[29] (Uplink FDD) EVM (rms) (dB), Typical
Frequency 5 MHz Bandwidth 10 MHz Bandwidth 20 MHz Bandwidth
700 MHz -56 -56 -54
900 MHz -55 -55 -53
1,430 MHz -54 -54 -53
1,750 MHz -51 -50 -50
1,900 MHz -51 -50 -50
2,500 MHz -50 -49 -49

WCDMA

Figure 16. WCDMA Measured Spectrum[30] (ACP)

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Baseband Characteristics

Analog-to-digital converters (ADCs)

Resolution

16 bits

Sample rate[31]

120 MS/s

I/Q data rate[32]

1.84 kS/s to 120 MS/s

Digital-to-analog converters (DACs)

Resolution

16 bits

Sample rate[33]

120 MS/s

I/Q data rate[34]

1.84 kS/s to 120 MS/s

Onboard FPGA

FPGA

Xilinx Virtex-6 LX195T

LUTs

124,800

Flip-flops

249,600

DSP48 slices

640

Embedded block RAM

12,384 kbits

Data transfers

DMA, interrupts, programmed I/O

Number of DMA channels

16

Onboard DRAM

Memory size

2 banks, 256 MB per bank

Theoretical maximum data rate

2.1 GB/s per bank

Onboard SRAM

Memory size

2 MB

Maximum data rate (read)

40 MB/s

Maximum data rate (write)

36 MB/s

Front Panel I/O

RF IN

Connector

SMA (female)

Input impedance

50 Ω, nominal, AC coupled

Maximum DC input voltage without damage

8 V

Absolute maximum input power[35]

+33 dBm (CW RMS)

Input Return Loss (Voltage Standing Wave Ratio (VSWR))

Table 28. Input Return Loss (dB) (VSWR)
Frequency Typical
109 MHz ≤ f < 2.4 GHz 15.5 (1.40:1)
2.4 GHz ≤ f < 4 GHz 12.7 (1.60:1)
4 GHz ≤ f ≤ 6 GHz 11.0 (1.78:1)
Return loss for frequencies <109 MHz is typically better than 14 dB (VSWR <1.5:1).

RF OUT

Connector

SMA (female)

Output impedance

50 Ω, nominal, AC coupled

Absolute maximum reverse power[36]

<4 GHz

+33 dBm (CW RMS)

≥4 GHz

+30 dBm (CW RMS)

Output Return Loss (VSWR)

Table 29. Output Return Loss (dB) (VSWR)
Frequency Typical
109 MHz ≤ f < 2 GHz 19.0 (1.25:1)
2 GHz ≤ f < 5 GHz 14.0 (1.50:1)
5 GHz ≤ f ≤ 6 GHz 11.0 (1.78:1)
Return loss for frequencies < 109 MHz is typically better than 20 dB (VSWR < 1.22:1).

CAL IN, CAL OUT

Connector

SMA (female)

Impedance

50 Ω, nominal

Caution Do not disconnect the cable that connects CAL IN to CAL OUT. Removing the cable from or tampering with the CAL IN or CAL OUT front panel connectors voids the product calibration and specifications are no longer warranted.

LO OUT (RF IN 0 and RF OUT 0)

Connectors

SMA (female)

Frequency range[37]

65 MHz to 6 GHz

Power

LO OUT (RF IN 0) 65 MHz to 6 GHz

0 dBm ±2 dB, typical

LO OUT (RF OUT 0)

65 MHz to 3.6 GHz

0 dBm ±2 dB, typical

≥3.6 GHz to 6 GHz

3 dBm ±2 dB, typical

Output power resolution

0.25 dB, nominal

Output impedance

50 Ω, nominal, AC coupled

Output return loss

>11.0 dB (VSWR <1.8:1), typical

Output isolation (state: disabled)

<2.5 GHz tuned LO

-45 dBc, nominal

≥2.5 GHz tuned LO

-35 dBc, nominal

LO IN (RF IN 0 and RF OUT 0)

Connectors

SMA (female)

Frequency range[38]

65 MHz to 6 GHz

Expected input power

LO IN (RF IN 0) 65 MHz to 6 GHz

0 dBm ±3 dB, nominal

LO IN (RF OUT 0)

65 MHz to 3.6 GHz

0 dBm ±3 dB, nominal

≥3.6 GHz to 6 GHz

3 dBm ±1 dB, nominal

Input impedance

50 Ω, nominal, AC coupled

Input return loss

>11.7 dB (VSWR <1.7:1), typical

Absolute maximum power

+15 dBm

Maximum DC voltage

±5 VDC

REF IN

Connector

SMA (female)

Frequency

10 MHz

Tolerance[39]

±10 × 10-6

Amplitude

Square

0.7 Vpk-pk to 5.0 Vpk-pk into 50 Ω, typical

Sine[40]

1.4 Vpk-pk to 5.0 Vpk-pk into 50 Ω, typical

Input impedance

50 Ω, nominal

Coupling

AC

REF OUT

Connector

SMA (female)

Frequency

Reference Clock[41]

10 MHz, nominal

Sample Clock

120 MHz, nominal

Amplitude

1.65 Vpk-pk into 50 Ω, nominal

Output impedance

50 Ω, nominal

Coupling

AC

PFI 0

Connector

SMA (female)

Voltage levels[42]

Absolute maximum input range

-0.5 V to 5.5 V

VIL

0.8 V

VIH

2.0 V

VOL

0.2 V with 100 μA load

VOH

2.9 V with 100 μA load

Input impedance

10 kΩ, nominal

Output impedance

50 Ω, nominal

Maximum DC drive strength

24 mA

Minimum required direction change latency[43]

48 ns + 1 clock cycle

DIGITAL I/O

Connector

VHDCI

Table 30. DIGITAL I/O Signal Characteristics
Signal Direction Port Width
DIO <23..20> Bidirectional, per port 4
DIO <19..16> Bidirectional, per port 4
DIO <15..12> Bidirectional, per port 4
DIO <11..8> Bidirectional, per port 4
DIO <7..4> Bidirectional, per port 4
DIO <3..0> Bidirectional, per port 4
PFI 1 Bidirectional 1
PFI 2 Bidirectional 1
Clock In Input 1
Clock Out Output 1
Voltage levels[44]

Absolute maximum input range

-0.5 V to 4.5 V

VIL

0.8 V

VIH

2.0 V

VOL

0.2 V with 100 μA load

VOH

2.9 V with 100 μA load

Input impedance

DIO <23..0>, CLK IN

10 kΩ, nominal

PFI 1, PFI 2

100 kΩ pull up, nominal

Output impedance

50 Ω, nominal

Maximum DC drive strength

12 mA

Minimum required direction change latency[45]

48 ns + 1 clock cycle

Maximum toggle rate

125 MHz, typical

Figure 17. DIGITAL I/O VHDCI Connector

1378

Power Requirements

Table 31. Power Requirements
Voltage (VDC) Typical Current (A) Maximum Current (A)
+3.3 4.9 5.3
+12 3.3 4.2
Power is 56 W, typical. Consumption is from both PXI Express backplane power connectors.

Physical Characteristics

PXIe-5644 module

3U, three slot, PXI Express module 6.1 cm × 12.9 cm × 21.1 cm(2.4 in × 5.6 in × 8.3 in)

Weight

1,360 g (48.0 oz)

Environment

Maximum altitude

2,000 m (800 mbar) (at 25 °C ambient temperature)

Pollution Degree

2

Indoor use only.

Operating Environment

Ambient temperature range

0 °C to 55 °C

Relative humidity range

10% to 90%, noncondensing

Storage Environment

Ambient temperature range

-40 °C to 71 °C

Relative humidity range

5% to 95%, noncondensing

Shock and Vibration

Operating shock

30 g peak, half-sine, 11 ms pulse

Random vibration

Operating

5 Hz to 500 Hz, 0.3 grms

Nonoperating

5 Hz to 500 Hz, 2.4 grms

Compliance and Certifications

Safety Compliance Standards

This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

  • IEC 61010-1, EN 61010-1
  • UL 61010-1, CSA C22.2 No. 61010-1
Note For safety certifications, refer to the product label or the Product Certifications and Declarations section.

Electromagnetic Compatibility

This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:
  • EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
  • EN 55011 (CISPR 11): Group 1, Class A emissions
  • EN 55022 (CISPR 22): Class A emissions
  • EN 55024 (CISPR 24): Immunity
  • AS/NZS CISPR 11: Group 1, Class A emissions
  • AS/NZS CISPR 22: Class A emissions
  • FCC 47 CFR Part 15B: Class A emissions
  • ICES-001: Class A emissions
Note In the United States (per FCC 47 CFR), Class A equipment is intended for use in commercial, light-industrial, and heavy-industrial locations. In Europe, Canada, Australia, and New Zealand (per CISPR 11), Class A equipment is intended for use only in heavy-industrial locations.
Note Group 1 equipment (per CISPR 11) is any industrial, scientific, or medical equipment that does not intentionally generate radio frequency energy for the treatment of material or inspection/analysis purposes.
Note For EMC declarations, certifications, and additional information, refer to the Product Certifications and Declarations section.

Product Certifications and Declarations

Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for NI products, visit ni.com/product-certifications, search by model number, and click the appropriate link.

Environmental Management

NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

For additional environmental information, refer to the Engineering a Healthy Planet web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

EU and UK Customers

  • 1378 Waste Electrical and Electronic Equipment (WEEE)—At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

    • 电子信息产品污染控制管理办法（中国RoHS）

  • 1378 中国RoHS— NI符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于NI中国RoHS合规性信息，请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

    • 1 Digitally equalized RF input and RF output bandwidth. Bandwidth is restricted to 20 MHz for LO frequencies ≤ 109 MHz and restricted to 40 MHz for LO frequencies between 109 MHz and 375 MHz.

    2 Tuning resolution combines LO step size capability and frequency shift DSP implemented on the FPGA.

    3 Medium loop bandwidth is available only in fractional mode.

    4 Conditions: Measured port: LO Out; Reference Clock: internal; medium loop bandwidth.

    5 Conditions: Measured port: LO Out; Reference Clock: internal.

    6 Constant LO frequency, constant RF input signal, varying input reference level.

    7 LO tuning across harmonic filter bands, constant RF input signal, varying input reference level.

    8 Measurement performed after self-calibration.

    9 dBr is relative to the full scale of the configured RF reference level.

    10 Conditions: VSA frequency range 109 MHz to 6 GHz. Measurement performed after self-calibration.

    11 Measurement performed after self-calibration.

    12

    Conditions: Two -10 dBm tones, 700 kHz apart at RF IN; reference level: -2 dBm; nominal noise floor: -145 dBm/Hz.

    13 Higher output is uncalibrated and may be compressed.

    14 Up to 12 dB crest factor, based on 3GPP LTE uplink requirements.

    15 Average output power ≥ -100 dBm.

    16 Constant LO frequency, varying RF output power range. Power levels ≤ 0 dBm. 175 μs for power levels > 0 dBm.

    17 LO tuning across harmonic filter bands.

    18 Harmonic suppression is reduced in this frequency range. As a result, offset errors may occur depending on whether you are using a true RMS device, such as a power meter.

    19 Conditions: Output -10 dBm CW tone. Measurement performed after self-calibration.

    20 Measured using 1 MHz baseband signal -1 dBFS; fundamental signal measured at +6 dBm CW.

    21 Measurement performed after self-calibration.

    22 Measurement performed after self-calibration.

    23 Conditions: EVM signal: 20 MHz bandwidth; 64 QAM signal. Pulse-shape filtering: root-raised-cosine, alpha=0.25; PXIe-5644 reference level: -10 dBm; Reference Clock source: internal; record length: 300 μs. Generator: PXIe-5673; power (average): -14 dBm; Reference Clock source: internal.

    24 Conditions: 20 MHz bandwidth, 64 QAM; centered at LO frequency or offset digitally as listed.

    25 Conditions: EVM signal: 20 MHz bandwidth; 64 QAM signal. Pulse-shape filtering: root-raised cosine, alpha=0.25; PXIe-5644 peak output power: -10 dBm; Reference Clock source: internal. Measurement instrument: PXIe-5665; reference level: -10 dBm; Reference Clock source: internal; record length: 300 μs.

    26 Conditions: 20 MHz bandwidth, 64 QAM; centered at LO frequency or offset digitally as listed.

    27 Conditions: RF OUT loopback to RF IN; 5,800 MHz; 80 MHz bandwidth; average power: -30 dBm to -5 dBm; 20 packets; 16 OFDM data symbols; MCS=9; 256 QAM.

    28 Conditions: RF OUT loopback to RF IN; 2,412 MHz; 20 MHz bandwidth; average power -10 dBm; reference level: auto-leveled based on real-time average power measurement; averages: 10; pulse-shaping filter: Gaussian reference; CCK 11 Mbps.

    29 Single channel uplink only.

    30 Conditions: DL Test Model 1 (64DPCH); RF output level: -10 dBm average; RF OUT loopback to RF IN; measured results better than -66 dB.

    31 ADCs are dual-channel components with each channel assigned to I and Q, respectively.

    32 I/Q data rates lower than 120 MS/s are achieved using fractional decimation.

    33 DACs are dual-channel components with each channel assigned to I and Q, respectively. DAC sample rate is internally interpolated to 960 MS/s, automatically configured.

    34 I/Q data rates lower than 120 MS/s are achieved using fractional interpolation.

    35 For modulated signals, peak instantaneous power not to exceed +36 dBm.

    36 For modulated signals, peak instantaneous power not to exceed corresponding peak power of specified CW.

    37 When tuning to 65 MHz to 375 MHz using the RF IN channel, the exported LO is twice the RF frequency requested.

    38 When tuning to 65 MHz to 375 MHz using the RF IN channel, the exported LO is twice the RF frequency requested.

    39 Frequency Accuracy = Tolerance × Reference Frequency

    40 1 Vrms to 3.5 Vrms, typical. Jitter performance improves with increased slew rate of input signal.

    41 Refer to the Internal Frequency Reference for accuracy.

    42 Voltage levels are guaranteed by design through the digital buffer specifications.

    43 Clock cycle refers to the FPGA clock domain used for direction control.

    44 Voltage levels are guaranteed by design through the digital buffer specifications.

    45 Clock cycle refers to the FPGA clock domain used for direction control.