¹ The ambient temperature of a PXI system is defined as the temperature at the chassis fan inlet (air intake).

² For increased capability, NI recommends installing the PXIe-4147 in a chassis with slot cooling capacity ≥58 W.

³ Channels isolated from earth ground, but share a common LO for all channels (bank isolation).

⁴ Power limit defined by voltage measured between HI and LO terminals.

⁵ Sourcing power may be limited by total power available from the chassis power supply. Refer to the Performing a Power Budget on a PXI/PXIe System article for more information.

⁶ When sinking more than 15 W into the PXIe-4147, transients may not exceed 200 mW/µs.

⁷ Refer to the Remote Sense and Load Regulation sections for additional accuracy derating and conditions.

⁸ Temperature coefficient applies beyond 23 °C±5 °C ambient within ±5 °C of T_cal.

⁹ T_cal is the internal device temperature recorded by the PXIe-4147 at the completion of the last self-calibration.

¹⁰ Multiple-channel specifications apply whenever two or more channels are connected and sourcing/sinking current. Multiple-channel specifications account for interactions between the channels when operated at high current, including board heating.

¹¹ Single-channel specifications assume only one channel is connected and sourcing/sinking current which results in improved accuracy due to the reduction of effects between the channels, including board heating. When transitioning from a multiple-channel configuration to a single-channel configuration, a ten-minute cool down period is required to meet Single Channel accuracy specifications.

¹² Relative humidity between 10% and 70%, noncondensing. When operating above 70% relative humidity, add 30 pA to current accuracy specifications.

¹³ Temperature coefficient applies beyond 23 °C±5 °C ambient within ±5 °C of T_cal.

¹⁴ T_cal is the internal device temperature recorded by the PXIe-4147 at the completion of the last self-calibration.

¹⁵ Multiple-channel specifications apply whenever two or more channels are connected and sourcing/sinking current. Multiple-channel specifications account for interactions between the channels when operated at high current, including board heating.

¹⁶ Single-channel specifications assume only one channel is connected and sourcing/sinking current which results in improved accuracy due to the reduction of effects between the channels, including board heating. When transitioning from a multiple-channel configuration to a single-channel configuration, a ten-minute cool down period is required to meet Single Channel accuracy specifications.

¹⁷ 10 Hz to 20 MHz bandwidth. PXIe-4147 configured for normal transient response.

¹⁸ Measured as the time to settle to within 0.1% of step amplitude, PXIe-4147 configured for fast transient response.

¹⁹ Current limit set to ≥30 μA and ≥20% of the selected current limit range.

²⁰ Voltage limit set to ≥2 V, resistive load set to 1 V/selected current range.

²¹ Time to recover within 10 mV after a load current change from 10% to 90% of range, PXIe-4147 configured for fast transient response.

²² At the output terminals of attached TB-414X Screw Terminal Connector Kit.

²³ Channels isolated from earth ground, but share a common LO for all channels (bank isolation).

²⁴ Accuracy is typical and applies within ±5 °C of last self calibration.

²⁵ When source-measuring, both the NI-DCPowerSource Delay and Aperture Time properties affect the sampling rate. When taking a measure record, only the Aperture Time property affects the sampling rate.

²⁶ As the source delay is adjusted or if advanced sequencing is used, maximum source update rates may vary.

²⁷ Pulse widths and logic levels are compliant with PXI Express Hardware Specification Revision 1.0 ECN 1.

²⁸ Input triggers can come from any source (PXI trigger or software trigger) and be exported to any PXI trigger line. This allows for easier multi-board synchronization regardless of the trigger source.

²⁹ Not all chassis can achieve this ambient temperature range. Refer to PXI chassis specifications to determine the ambient temperature ranges your chassis can achieve.

³⁰ When transitioning a device from a storage or operation environment with relative humidity above 70%, device should be allowed to stabilize in the lower humidity environment for several hours before use. Refer to the PXIe-4147Programming and Measurement Accuracy/Resolution specifications for additional performance derating when operating above 70% relative humidity.