PXIe-6594 Specifications

Definitions

Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

  • Typical specifications describe the performance met by a majority of models.
  • Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.
  • Measured specifications describe the measured performance of a representative model.

Specifications are Typical unless otherwise noted.

Conditions

Specifications are valid under the following conditions unless otherwise noted.

  • Ambient temperature of 23 °C ±5 °C
  • Installed in chassis with slot cooling capacity ≥58 W

PORT 0, PORT 1

Data rate

500 Mb/s to 28.2 Gb/s

Connector

QSFP, SFF-8436 compliant

Number of channels

8 RX/TX (GTY)

Supported high-speed cable type

Electrical with data rates up to 28.2 Gb/s, Optical with data rates up to 16.3 Gb/s

Optical cable power

3.3 V ±5%, 1 A per port

MGT TX± Channels[1]

Minimum differential output voltage[2]

170 mV pk-pk into 100 Ω, nominal

I/O coupling

AC-coupled, includes 100 nF capacitor

MGT RX± Channels

Differential input voltage range

≤ 6.6 Gb/s

150 mV pk-pk to 2000 mV pk-pk, nominal

> 6.6 Gb/s

150 mV pk-pk to 1250 mV pk-pk, nominal

Differential input resistance

100 Ω, nominal

I/O coupling

DC-coupled, requires external capacitor

MGT Reference Clock Generator

Supported output frequencies

60.000 MHz to 385.714 MHz

400.000 MHz to 450.000 MHz

480.000 MHz to 675.000 MHz

685.714 MHz to 771.428 MHz

800 MHz

Locking resources

PXIe_CLK100

REF/CLK IN

Available MGT Reference Clocks

4

CLK OUT

Connector type

SMA

Coupling

AC

Output impedance

50 Ω, nominal

Supported output frequencies

2.344 MHz to 385.714 MHz

400.000 MHz to 450.000 MHz

480.000 MHz to 675.000 MHz

685.714 MHz to 771.428 MHz

800.000 MHz to 900.000 MHz

960.000 MHz to 1000.000 MHz

Output voltage range

0.61 V pk-pk to 1.04 V pk-pk

REF/CLK IN

Connector type

SMA

Input coupling

AC

Input impedance

50 Ω

Frequency range

10 MHz to 300 MHz

Input voltage range

0.3 V pk-pk to 4 V pk-pk

Absolute maximum voltage

5 V pk-pk AC

Duty cycle

45% to 55%

DIO

Connector

Molex™ Nano-Pitch I/O™

5.0 V Power

±5%, 50 mA maximum, nominal

Table 1. Digital I/O Signal Characteristics
Signal Type Direction
MGT Tx± <0..3> Xilinx UltraScale+ GTY Output
MGT Rx± <0..3> Xilinx UltraScale+ GTY Input
DIO <0..7> Single-ended Bidirectional
5.0 V DC Output
GND Ground

Digital I/O Single-Ended Channels

Number of channels

8

Signal type

Single-ended

Voltage families

3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V

Input impedance

100 kΩ, nominal

Output impedance

50 Ω, nominal

Direction control

Per channel

Minimum required direction change latency

200 ns

Maximum output toggle rate

60 MHz with 100 μA load, nominal

Table 2. Digital I/O Single-Ended DC Signal Characteristics[3]
Voltage Family (V) VIL (V) VIH (V) VOL (100 µA Load) (V) VOH (100 µA Load) (V) Maximum DC Drive Strength (mA)
3.3 0.8 2.0 0.2 3.0 24
2.5 0.7 1.6 0.2 2.2 18
1.8 0.62 1.29 0.2 1.5 16
1.5 0.51 1.07 0.2 1.2 12
1.2 0.42 0.87 0.2 0.9 6

Digital I/O High-Speed Serial MGT[4]

Data rate

500 Mb/s to 16.375 Gb/s, nominal

Number of Tx channels

4

Number of Rx channels

4

I/O coupling

MGT TX± channels

AC-coupled, includes 100 nF capacitor

MGT RX± channels

DC-coupled, requires external capacitor

Reconfigurable FPGA

Kintex Ultrascale+

15P

LUTs

523,000

DSP48 slices (25 × 18 multiplier)

1,968

Embedded Block RAM

34.6 Mb

Timebase reference sources

PXI Express 100 MHz (PXI_CLK100)

Data transfers

DMA, interrupts, programmed I/O, MGTs

Number of DMA channels

60

Onboard DRAM

Memory size

8 GB (2 banks of 4 GB)

DRAM clock rate

1333 MHz

Physical bus width

64 bit

LabVIEW FPGA DRAM clock rate

333 MHz

LabVIEW FPGA DRAM bus width

512 bits per bank

Maximum theoretical data rate

42.7 GB/s (21.3 GB/s per bank)

Bus Interface

Form factor

PCI Express Gen-3 x8

Maximum Power Requirements

Note Power requirements depend on the contents of the LabVIEW FPGA VI used in your application.

+3.3 V

3 A

+12 V

4 A

Maximum total power

58 W

Physical

Dimensions (not including connectors)

2.0 cm × 13.0 cm × 21.6 cm (0.8 in. × 5.1 in. × 8.5 in.)

Weight

520 g (18.3 oz)

Environment

Maximum altitude

2,000 m (800 mbar) (at 25 °C ambient temperature)

Pollution Degree

2

Indoor use only.

Operating Environment

Ambient temperature range

0 °C to 55 °C[5]

Relative humidity range

10% to 90%, noncondensing

Storage Environment

Ambient temperature range

-40 °C to 71 °C

Relative humidity range

5% to 95%, noncondensing

Shock and Vibration

Operating shock

30 g peak, half-sine, 11 ms pulse

Random vibration

Operating

5 Hz to 500 Hz, 0.3 grms

Nonoperating

5 Hz to 500 Hz, 2.4 grms

1 For detailed FPGA and High-Speed Serial Link specifications, refer to Xilinx documentation.

2 800 mV pk-pk when transmitter output swing is set to the maximum setting.

3 Voltage levels are guaranteed by design through the digital buffer specifications.

4 For detailed FPGA and High-Speed Serial Link specifications, refer to Xilinx documentation.

5 The PXIe-6594 requires a chassis with slot cooling capacity ≥58 W. Not all chassis with slot cooling capacity ≥58 W can achieve this ambient temperature range. Refer to the PXI Chassis Manual for specifications to determine the ambient temperature ranges your chassis can achieve.