PXIe-5646 Specifications

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Updated2023-04-06
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PXIe-5646 Specifications

Definitions

Warranted specifications describe the performance of a model under stated operating conditions and are covered by the model warranty.

Characteristics describe values that are relevant to the use of the model under stated operating conditions but are not covered by the model warranty.

Typical specifications describe the performance met by a majority of models.
Typical-95 specifications describe the performance met by 95% (≈2σ) of models with a 95% confidence.
Nominal specifications describe an attribute that is based on design, conformance testing, or supplemental testing.

Within the specifications, self-calibration °C refers to the recorded device temperature of the last successful self-calibration.

Specifications are Warranted unless otherwise noted.

Conditions

Specifications are valid under the following conditions unless otherwise noted.

30 minutes warm-up time.
Calibration cycle is maintained.
Chassis fan speed is set to High. In addition, NI recommends using slot blockers and EMC filler panels in empty module slots to minimize temperature drift.
Calibration IP is used properly during the creation of custom FPGA bitfiles.
Calibration Interconnect cable remains connected between CAL IN and CAL OUT front panel connectors.
The cable connecting CAL IN to CAL OUT has not been removed or tampered with.
Reference Clock source: Internal
RF IN reference level: 0 dBm
RF OUT power level: 0 dBm
LO tuning mode: Fractional
LO PLL loop bandwidth: Medium
LO step size: 200 kHz
LO frequency: 2.4 GHz
LO source: Internal

Frequency

The following characteristics are common to both RF IN 0 and RF OUT 0 ports.

Frequency range

65 MHz to 6 GHz

Table 1. PXIe-5646 Bandwidth
Center Frequency	Instantaneous Bandwidth
≤109 MHz	20 MHz
>109 MHz to <200 MHz	80 MHz
200 MHz to 6 GHz	200 MHz

Tuning resolution^[1]	888 nHz
LO step size, fractional mode	Programmable step size, 200 kHz default
LO step size, integer mode	2 MHz, 5 MHz, 10 MHz, 25 MHz

Frequency Settling Time

Table 2. Maximum Frequency Settling Time
Settling Time	Maximum Time (ms)
Settling Time	Low Loop Bandwidth	Medium Loop Bandwidth^[2] (default)	High Loop Bandwidth
≤1 × 10^-6 of final frequency	1.1	0.95	0.38
≤0.1 × 10^-6 of final frequency	1.2	1.05	0.4
The default medium loop bandwidth refers to a setting that adjusts PLL to balance tuning speed and phase noise, and it does not necessarily result in loop bandwidth between low and high. This specification includes only frequency settling and excludes any residual amplitude settling.

Internal Frequency Reference

Initial adjustment accuracy	±200 × 10 ^-9
Temperature stability	±1 × 10^-6, maximum
Aging	±1 × 10 ^-6 per year, maximum
Accuracy	Initial adjustment accuracy ± Aging ± Temperature stability

Frequency Reference Input (REF IN)

Refer to the REF IN section.

Frequency Reference/Sample Clock Output (REF OUT)

Refer to the REF OUT section.

Spectral Purity

Table 3. Single Sideband Phase Noise
Frequency	Phase Noise (dBc/Hz), 20 kHz Offset (Single Sideband)
Frequency	Low Loop Bandwidth	Medium Loop Bandwidth	High Loop Bandwidth
<3 GHz	-99	-99	-94
3 GHz to 4 GHz	-91	-93	-91
>4 GHz to 6 GHz	-93	-93	-87

1378 — Figure 1. Measured Phase Noise^[3] at 900 MHz, 2.4 GHz, and 5.8 GHz

RF Input Amplitude Range

Amplitude range	Average noise level to +30 dBm (CW RMS)
RF reference level range/resolution	≥60 dB in 1 dB nominal steps

RF Input Amplitude Settling Time

<0.1 dB of final value^[5]	125 μs, typical
<0.5 dB of final value^[6], with LO retuned	300 μs

RF Input Absolute Amplitude Accuracy

Table 4. VSA Absolute Amplitude Accuracy (dB)
Center Frequency	15 °C to 35 °C		0 °C to 55 °C
Center Frequency	Self-Calibration °C ± 1 °C	Self-Calibration °C ± 5 °C	Self-Calibration °C ± 1 °C	Self-Calibration °C ± 5 °C
65 MHz to <375 MHz	—	±0.70	—	±0.75
	—	±0.65 (95th percentile, ≈ 2σ)	—	±0.65 (95th percentile, ≈ 2σ)
	±0.34, typical	±0.50, typical	±0.36, typical	±0.55, typical
375 MHz to <2 GHz	—	±0.65	—	±0.70
	—	±0.55 (95th percentile, ≈ 2σ)	—	±0.55 (95th percentile, ≈ 2σ)
	±0.17, typical	±0.35, typical	±0.22, typical	±0.40, typical
2 GHz to <4 GHz	—	±0.70	—	±0.75
	—	±0.55 (95th percentile, ≈ 2σ)	—	±0.60 (95th percentile, ≈ 2σ)
	±0.23, typical	±0.40, typical	±0.26, typical	±0.40, typical
4 GHz to 6 GHz	—	±0.90	—	±0.95
	—	±0.75 (95th percentile, ≈ 2σ)	—	±0.80 (95th percentile, ≈ 2σ)
	±0.30, typical	±0.55, typical	±0.33, typical	±0.55, typical
Conditions: Reference level -30 dBm to +30 dBm; measured at 3.75 MHz offset from the configured center frequency; measurement performed after the PXIe-5646 has settled. For reference levels <-30 dBm, absolute amplitude gain accuracy is ±0.6 dB, typical for frequencies ≤ 4 GHz, and ±0.8 dB, typical for frequencies > 4 GHz. Performance depends on signal-to-noise ratio. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

RF Input Frequency Response

Table 5. VSA Frequency Response (dB) (Amplitude, Equalized)
RF Input Frequency	Bandwidth	Self-Calibration °C ± 5 °C
≤109 MHz	20 MHz	±0.8 dB
>109 MHz to <200 MHz	40 MHz	±0.5 dB
	80 MHz	±0.5 dB, typical
	80 MHz	±0.8 dB
≥200 MHz to 6 GHz	80 MHz	±0.5 dB
	200 MHz	±0.5 dB, typical
	200 MHz	±1.05 dB
Conditions: Reference level -30 dBm to +30 dBm. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors. Frequency response represents the relative flatness within a specified instantaneous bandwidth. Frequency response specifications are valid within any given frequency range and not the LO frequency itself.

RF Input Average Noise Density

Table 6. Average Noise Density (dBm/Hz)
Center Frequency	Average Noise Level
Center Frequency	-50 dBm Reference Level	-10 dBm Reference Level
65 MHz to 4 GHz	-159	-145
65 MHz to 4 GHz	-161, typical	-148, typical
>4 GHz to 6 GHz	-156	-144
>4 GHz to 6 GHz	-158, typical	-146, typical
Conditions: Input terminated with a 50 Ω load; 50 averages; RMS average noise level normalized to a 1 Hz noise bandwidth. The -50 dBm reference level configuration has the inline preamplifier enabled, which represents the high sensitivity operation of the receive path.

RF Input Nonharmonic Spurs

Table 7. RF Input Nonharmonic Spurs (dBc)
Frequency	<100 kHz Offset	≥100 kHz Offset	>1 MHz Offset
65 MHz to 3 GHz	<-55, typical	<-60	<-75
>3 GHz to 6 GHz	<-55, typical	<-55	<-70
Conditions: Reference level ≥-30 dBm. Measured with a single tone, -1 dBr, where dBr is referenced to the configured RF reference level. Excludes baseband mixing spurs.

RF Input LO Residual Power

Table 8. VSA LO Residual Power (dBr^[7])
Center Frequency	Self-Calibration °C ± 1 °C	Self-Calibration °C ± 5 °C
≤109 MHz	—	-62
≤109 MHz	-70, typical	-67, typical
>109 MHz to 375 MHz	—	-55
>109 MHz to 375 MHz	-65, typical	-61, typical
>375 MHz to 1 GHz	—	-55
>375 MHz to 1 GHz	-60, typical	-59, typical
>1 GHz to 1.5 GHz	—	-52
>1 GHz to 1.5 GHz	-58, typical	-56, typical
>1.5 GHz to 2 GHz	—	-47
>1.5 GHz to 2 GHz	-58, typical	-54, typical
>2 GHz to 3 GHz	—	-54
>2 GHz to 3 GHz	-60, typical	-58, typical
>3 GHz to 4 GHz	—	-45
>3 GHz to 4 GHz	-52, typical	-49, typical
>4 GHz to 6 GHz		-43
>4 GHz to 6 GHz	-51, typical	-47, typical
Conditions: Reference levels -30 dBm to +30 dBm; measured at ADC. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors. For optimal performance, NI recommends running self-calibration when the PXIe-5646 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >±5 °C from self-calibration, LO residual power is -35 dBr.

RF Input Residual Sideband Image

Table 9. VSA Residual Sideband Image (dBc)
Center Frequency	Bandwidth	Self-Calibration °C ± 1 °C	Self-Calibration °C ± 5 °C
≤109 MHz	20 MHz	—	-40
≤109 MHz	20 MHz	-60, typical	-50, typical
>109 MHz to <200 MHz	80 MHz	—	-40
>109 MHz to <200 MHz	80 MHz	-50, typical	-45, typical
≥200 MHz to 500 MHz	200 MHz	—	-40
≥200 MHz to 500 MHz	200 MHz	-50, typical	-45, typical
>500 MHz to 3 GHz	≤180 MHz	—	-62
	≤180 MHz	-75, typical	-70, typical
	>180 MHz to 200 MHz	—	-60
	>180 MHz to 200 MHz	-75, typical	-65, typical
>3 GHz to 6 GHz	≤180 MHz	—	-60
	≤180 MHz	-70, typical	-67, typical
	>180 MHz to 200 MHz	—	-59
	>180 MHz to 200 MHz	-70, typical	-63, typical
Conditions: Reference levels -30 dBm to +30 dBm. Frequency response specifications are valid within any given frequency range, not the LO frequency itself. This specification describes the maximum residual sideband image within a 200 MHz bandwidth at a given RF center frequency. Bandwidth is restricted to 20 MHz for LO frequencies ≤ 109 MHz. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors. For optimal performance, NI recommends running self-calibration when the PXIe-5646 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, residual image suppression is -40 dBc.

RF Input Third-Order Intermodulation

Table 10. RF Input Third-Order Intercept Point (IIP₃), -5 dBm Reference Level, Typical
Frequency Range	IIP₃ (dBm)
65 MHz to 1.5 GHz	19
>1.5 GHz to 6 GHz	20
Conditions: Two -10 dBm tones, 700 kHz apart at RF IN; reference level: -5 dBm<4 GHz, -2 dBm reference level otherwise; nominal noise floor: -148 dBm/Hz for -5 dBm reference level, -145 dBm/Hz for -2 dBm reference level.

Table 11. RF Input Third-Order Intercept Point (IIP₃), -20 dBm Reference Level, Typical
Frequency Range	IIP₃ (dBm)
65 MHz to 200 MHz	9
>200 MHz to 2 GHz	11
>2 GHz to 3.75 GHz	8
>3.75 GHz to 4.25 GHz	6
>4.25 GHz to 5 GHz	4
>5 GHz to 6 GHz	1
Conditions: Two -25 dBm tones, 700 kHz apart at RF IN; reference level: -20 dBm; nominal noise floor: -157 dBm/Hz.

RF Input Second-Order Intermodulation

Table 12. RF Input Second-Order Intercept Point (IIP₂), -2 dBm Reference Level, Typical^[10]
Frequency Range	IIP₂ (dBm)
65 MHz to 1.5 GHz	67
>1.5 GHz to 4 GHz	58
>4 GHz to 6 GHz	52

RF Output Power Range

Table 13. RF Output Power Range
Output Type	Frequency	Power Range
CW	<4 GHz	Noise floor to +10 dBm, average power^[11]	Noise floor to +15 dBm, average power, nominal
CW	≥4 GHz	Noise floor to +7 dBm, average power^[11]	Noise floor to +12 dBm, average power, nominal
Modulated^[12]	<4 GHz	Noise floor to +6 dBm, average power	—
Modulated^[12]	≥4 GHz	Noise floor to +3 dBm, average power	—

Output attenuator resolution	2 dB, nominal
Digital attenuation resolution^[13]	0.1 dB or better

RF Output Amplitude Settling Time

0.1 dB of final value^[14]	50 μs
0.5 dB of final value^[15], with LO retuned	300 μs

RF Output Power Level Accuracy

Table 14. RF Output Power Level Accuracy (dB)
Center Frequency	15 °C to 35 °C		0 °C to 55 °C
Center Frequency	Self-Calibration°C ± 1 °C	Self-Calibration°C ± 5 °C	Self-Calibration°C ± 1 °C	Self-Calibration°C ± 5 °C
65 MHz to <109 MHz	—	±0.70	—	±0.90
	—	±0.55 (95th percentile, ≈ 2σ)	—	±0.65 (95th percentile, ≈ 2σ)
	±0.26, typical	±0.40, typical	±0.36, typical	±0.50, typical
109 MHz to <270 MHz^[16]	±0.26, typical	±0.75	±0.36, typical	±0.90
		±0.60 (95th percentile; ≈ 2σ)		±0.70 (95th percentile; ≈ 2σ)
		±0.45, typical		±0.55, typical
270 MHz to <375 MHz	—	±0.70	—	±0.90
	—	±0.55 (95th percentile, ≈ 2σ)	—	±0.65 (95th percentile, ≈ 2σ)
	±0.26, typical	±0.40, typical	±0.36, typical	±0.50, typical
375 MHz to <2 GHz	—	±0.75	—	±0.90
	—	±0.55 (95th percentile, ≈ 2σ)	—	±0.65 (95th percentile, ≈ 2σ)
	±0.26, typical	±0.40, typical	±0.36, typical	±0.50, typical
2 GHz to <4 GHz	—	±0.75	—	±0.90
	—	±0.60 (95th percentile, ≈ 2σ)	—	±0.70 (95th percentile, ≈ 2σ)
	±0.26, typical	±0.40, typical	±0.36, typical	±0.50, typical
4 GHz to 6 GHz	—	±1.00	—	±1.15
	—	±0.80 (95th percentile, ≈ 2σ)	—	±0.90 (95th percentile, ≈ 2σ)
	±0.28, typical	±0.40, typical	±0.38, typical	±0.60, typical
Conditions: CW average power -70 dBm to +10 dBm. For power <-70 dBm, highly accurate generation can be achieved using digital attenuation, which relies on DAC linearity. The absolute amplitude accuracy is measured at 3.75 MHz offset from the configured center frequency. The absolute amplitude accuracy measurements are made after the PXIe-5646 has settled. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors.

RF Output Frequency Response

Table 15. VSG Frequency Response (dB) (Amplitude, Equalized)
Output Frequency	Bandwidth	Self-Calibration °C ± 5 °C
≤109 MHz	20 MHz	±0.9 dB
>109 MHz to <200 MHz	40 MHz	±0.5 dB
	80 MHz	±0.5 dB, typical
	80 MHz	±0.9 dB
≥200 MHz to 6 GHz	80 MHz	±0.5 dB
	200 MHz	±0.5 dB, typical
	200 MHz	±1.1 dB
Conditions: Reference level -30 dBm to +30 dBm. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors. Frequency response represents the relative flatness within a specified instantaneous bandwidth. Frequency response specifications are valid within any given frequency range and not the LO frequency itself.

RF Output Noise Density

Table 16. Average Output Noise Level (dBm/Hz)
Center Frequency	Power Setting
Center Frequency	-30 dBm	0 dBm	10 dBm
65 MHz to 500 MHz	—	—	—
65 MHz to 500 MHz	-168, typical	-150, typical	-130, typical
>500 MHz to 1 GHz	—	—	—
>500 MHz to 1 GHz	-168, typical	-147, typical	-137, typical
>1 GHz to 2.5 GHz	—	-149	-141
>1 GHz to 2.5 GHz	-168, typical	-151, typical	-143, typical
>2.5 GHz to 3.5 GHz	—	-150	-140
>2.5 GHz to 3.5 GHz	-168, typical	-153, typical	-143, typical
>3.5 GHz to 5 GHz	—	-144	-136
>3.5 GHz to 5 GHz	-168, typical	-147, typical	-138, typical
>5 GHz to 6 GHz	—	-147	-138
>5 GHz to 6 GHz	-168, typical	-149, typical	-140, typical
Conditions: Averages: 200 sweeps; baseband signal attenuation: -40 dB; noise measurement frequency offset: 4 MHz relative to output tone frequency.

RF Output Harmonics

Table 17. Second Harmonic Level (dBc)
Fundamental Frequency	23 °C ± 5 °C	0 °C to 55 °C
65 MHz to 3.5 GHz	-27	-24
65 MHz to 3.5 GHz	-29, typical	-27, typical
>3.5 GHz to 4.5 GHz	-26	-24
>3.5 GHz to 4.5 GHz	-28, typical	-26, typical
>4.5 GHz to 6 GHz	-28	-26
>4.5 GHz to 6 GHz	-33, typical	-31, typical
Conditions: Measured using 1 MHz baseband signal -1 dBFS; fundamental signal measured at +6 dBm CW; second harmonic levels nominally <-30 dBc for fundamental output levels of ≤5 dBm

Note Higher order harmonic suppression is degraded in the range of 109 MHz to 270 MHz and third harmonic performance is shown in the following figure. For frequencies outside the range of 109 MHz to 270 MHz, higher order harmonic distortion is equal to or better than the second harmonic level as specified in the previous table.

RF Output Nonharmonic Spurs

Table 18. RF Output Nonharmonic Spurs (dBc)
Frequency	<100 kHz Offset	≥100 kHz Offset	>1 MHz Offset
65 MHz to 3 GHz	<-55, typical	<-62	<-75
>3 GHz to 6 GHz	<-55, typical	<-57	<-70
Conditions: Output full scale level ≥-30 dBm. Measured with a single tone at -1 dBFS.

RF Output Third-Order Intermodulation

Table 19. RF Output Third-Order Intermodulation Distortion (IMD₃) (dBc), 0 dBm Tones
Fundamental Frequency	Baseband DAC: -2 dBFS	Baseband DAC: -6 dBFS
65 MHz to 1 GHz	-55, typical	-60, typical
>1 GHz to 3 GHz	-53, typical	-53, typical
>3 GHz to 5 GHz	-49, typical	-50, typical
>5 GHz to 6 GHz	-44, typical	-45, typical
Conditions: Two 0 dBm tones, 500 kHz apart at RF OUT. RF gain applied to achieve the desired output power per tone.

Table 20. RF Output Third-Order Intermodulation Distortion (IMD₃) (dBc), -6 dBm Tones
Fundamental Frequency	Baseband DAC: -2 dBFS	Baseband DAC: -6 dBFS
65 MHz to 1.5 GHz	-50	-59
65 MHz to 1.5 GHz	-54, typical	-62, typical
>1.5 GHz to 3.5 GHz	-54	-59
>1.5 GHz to 3.5 GHz	-57, typical	-62, typical
>3.5 GHz to 5 GHz	-50	-55
>3.5 GHz to 5 GHz	-53, typical	-58, typical
>5 GHz to 6 GHz	-47	-51
>5 GHz to 6 GHz	-50, typical	-54, typical
Conditions: Two -6 dBm tones, 500 kHz apart at RF OUT. RF gain applied to achieve the desired output power per tone.

Table 21. RF Output Third-Order Intermodulation Distortion (IMD₃) (dBc), -36 dBm Tones
Fundamental Frequency	Baseband DAC: -2 dBFS	Baseband DAC: -6 dBFS
65 MHz to 200 MHz	-52	-57
65 MHz to 200 MHz	-54, typical	-60, typical
>200 MHz to 6 GHz	-52	-55
>200 MHz to 6 GHz	-54, typical	-58, typical
Conditions: Two -36 dBm tones, 500 kHz apart at RF OUT. RF gain applied to achieve the desired output power per tone.

RF Output LO Residual Power

Table 22. VSG LO Residual Power (dBc)
Center Frequency	Self-Calibration °C ± 1 °C	Self-Calibration °C ± 5 °C
≤109 MHz	—	—
≤109 MHz	-60, typical	-49, typical
>109 MHz to 375 MHz	—	-45
>109 MHz to 375 MHz	-52, typical	-50, typical
>375 MHz to 1 GHz	—	-53
>375 MHz to 1 GHz	-59, typical	-57, typical
1 GHz to 2 GHz	—	-55
1 GHz to 2 GHz	-60, typical	-63, typical
2 GHz to 3 GHz	—	-50
2 GHz to 3 GHz	-60, typical	-53, typical
3 GHz to 5 GHz	—	-53
3 GHz to 5 GHz	-58, typical	-55, typical
5 GHz to 6 GHz	—	-48
5 GHz to 6 GHz	-56, typical	-53, typical
Conditions: Configured power levels -50 dBm to +10 dBm. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors. For optimal performance, NI recommends running self-calibration when the PXIe-5646 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, LO residual power is -40 dBc.

Table 23. VSG LO Residual Power (dBc), Low Power
Center Frequency	Self-Calibration °C ± 5 °C
≤109 MHz	—
≤109 MHz	-49, typical
>109 MHz to 375 MHz	—
>109 MHz to 375 MHz	-50, typical
>375 MHz to 2 GHz	—
>375 MHz to 2 GHz	-60, typical
>2 GHz to 3 GHz	—
>2 GHz to 3 GHz	-53, typical
>3 GHz to 5 GHz	—
>3 GHz to 5 GHz	-58, typical
>5 GHz to 6 GHz	—
>5 GHz to 6 GHz	-55, typical
Conditions: configured power levels < -50 dBm to -70 dBm. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors. For optimal performance, NI recommends running self-calibration when the PXIe-5646 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, LO residual power is -40 dBc.

RF Output Residual Sideband Image

Table 24. VSG Residual Sideband Image (dBc)
Center Frequency	Bandwidth	Self-Calibration °C ± 1°C	Self-Calibration °C ± 5 °C
≤109 MHz	20 MHz	—	-40
≤109 MHz	20 MHz	-55, typical	-42, typical
>109 MHz to 200 MHz	80 MHz	—	—
>109 MHz to 200 MHz	80 MHz	-45, typical	-40, typical
>200 MHz to 500 MHz	200 MHz	—	-45
>200 MHz to 500 MHz	200 MHz	-45, typical	-50, typical
>500 MHz to 1 GHz	≤180 MHz	—	-60
	≤180 MHz	-70, typical	-63, typical
	≤180 MHz to 200 MHz	—	-57
	≤180 MHz to 200 MHz	-70, typical	-60, typical
>1 GHz to 2 GHz	200 MHz	—	-60
>1 GHz to 2 GHz	200 MHz	-70, typical	-63, typical
>2 GHz to 6 GHz	200 MHz	—	-50
>2 GHz to 6 GHz	200 MHz	-65, typical	-55, typical
Conditions: Reference levels -30 dBm to +30 dBm. This specification describes the maximum residual sideband image within a 200 MHz bandwidth at a given RF center frequency. Bandwidth is restricted to 20 MHz for LO frequencies ≤109 MHz. This specification is valid only when the module is operating within the specified ambient temperature range and within the specified range from the last self-calibration temperature, as measured with the onboard temperature sensors. For optimal performance, NI recommends running self-calibration when the PXIe-5646 temperature drifts ± 5 °C from the temperature at the last self-calibration. For temperature changes >± 5 °C from self-calibration, residual image suppression is -40 dBc.

VSA EVM

20 MHz bandwidth 64-QAM EVM^[20] 375 MHz to 6 GHz

-40 dB, typical

VSG EVM

20 MHz bandwidth 64-QAM EVM^[22] 375 MHz to 6 GHz

-40 dB, typical

Application-Specific Modulation Quality

Typical performance assumes the PXIe-5646 is operating within ± 5 °C of the previous self-calibration temperature, and that the ambient temperature is 0 °C to 55 °C.

WLAN 802.11ac

OFDM^[24]
80 MHz bandwidth	-45 dB (rms), typical
80 MHz bandwidth (channel tracking enabled, preamble and data)	-50 dB (rms), typical
160 MHz bandwidth	-43 dB (rms), typical
160 MHz bandwidth (channel tracking enabled, preamble and data)	-47 dB (rms), typical

WLAN 802.11n

Table 25. 802.11n OFDM EVM (rms) (dB), Typical
Frequency	20 MHz Bandwidth	40 MHz Bandwidth
2,412 MHz	-50	-50
5,000 MHz	-48	-46
Conditions: RF OUT loopback to RF IN; average power: -10 dBm; reference level: auto-leveled based on real-time average power measurement; 20 packets; 3/4 coding rate; 64 QAM.

WLAN 802.11a/g/j/p

Table 26. 802.11a/g/j/p OFDM EVM (rms) (dB), Typical
Frequency	20 MHz Bandwidth
2,412 MHz	-53
5,000 MHz	-50
Conditions: RF OUT loopback to RF IN; average power: -10 dBm; reference level: auto-leveled based on real-time average power measurement; 20 packets; 3/4 coding rate; 64 QAM.

WLAN 802.11g

Table 27. 802.11g DSSS-OFDM EVM (rms) (dB), Typical
Frequency	20 MHz Bandwidth
2,412 MHz	-53
5,000 MHz	-50
Conditions: RF OUT loopback to RF IN; average power: -10 dBm; reference level: auto-leveled based on real-time average power measurement; 20 packets; 3/4 coding rate; 64 QAM.

WLAN 802.11b/g

DSSS^[25]

-48 EVM (rms) dB, typical

LTE

Table 28. SC-FDMA^[26] (Uplink FDD) EVM (rms) (dB), Typical
Frequency	5 MHz Bandwidth	10 MHz Bandwidth	20 MHz Bandwidth
700 MHz	-56	-56	-54
900 MHz	-55	-55	-53
1,430 MHz	-54	-54	-53
1,750 MHz	-51	-50	-50
1,900 MHz	-51	-50	-50
2,500 MHz	-50	-49	-49

WCDMA

Baseband Characteristics

Analog-to-digital converters (ADCs)
Resolution	14 bits
Sample rate^[28]	250 MS/s
I/Q data rate^[29]	4 kS/s to 250 MS/s

Digital-to-analog converters (DACs)
Resolution	16 bits
Sample rate^[30]	250 MS/s
I/Q data rate^[31]	4 kS/s to 250 MS/s

Onboard FPGA

FPGA	Xilinx Virtex-6 LX240T
LUTs	150,720
Flip-flops	301,440
DSP48 slices	768
Embedded block RAM	14,976 kbits
Data transfers	DMA, interrupts, programmed I/O
Number of DMA channels	16

Onboard DRAM

Memory size	2 banks, 512 MB per bank
Theoretical maximum data rate	2.1 GB/s per bank

Onboard SRAM

Memory size	2 MB
Maximum data rate (read)	40 MB/s
Maximum data rate (write)	36 MB/s

Front Panel I/O

RF IN

Connector	SMA (female)
Input impedance	50 Ω, nominal, AC coupled
Maximum DC input voltage without damage	8 V
Absolute maximum input power^[32]	+33 dBm (CW RMS)

Input Return Loss (Voltage Standing Wave Ratio (VSWR))

Table 29. Input Return Loss (dB) (VSWR)
Frequency	Typical
109 MHz ≤ f < 2.4 GHz	15.5 (1.40:1)
2.4 GHz ≤ f < 4 GHz	12.7 (1.60:1)
4 GHz ≤ f ≤ 6 GHz	11.0 (1.78:1)
Return loss for frequencies <109 MHz is typically better than 14 dB (VSWR <1.5:1).

RF OUT

Connector	SMA (female)
Output impedance	50 Ω, nominal, AC coupled
Absolute maximum reverse power^[33], <4 GHz	+33 dBm (CW RMS)
Absolute maximum reverse power^[34], ≥4 GHz	+30 dBm (CW RMS)

Output Return Loss (VSWR)

Table 30. Output Return Loss (dB) (VSWR)
Frequency	Typical
109 MHz ≤ f < 2 GHz	19.0 (1.25:1)
2 GHz ≤ f < 5 GHz	14.0 (1.50:1)
5 GHz ≤ f ≤ 6 GHz	11.0 (1.78:1)
Return loss for frequencies < 109 MHz is typically better than 20 dB (VSWR < 1.22:1).

CAL IN, CAL OUT

Connector	SMA (female)
Impedance	50 Ω, nominal

Notice Do not disconnect the cable that connects CAL IN to CAL OUT. Removing the cable from or tampering with the CAL IN or CAL OUT front panel connectors voids the product calibration and specifications are no longer warranted.

LO OUT (RF IN 0 and RF OUT 0)

Connectors	SMA (female)
Frequency range^[35]	65 MHz to 6 GHz
LO OUT (RF IN 0) power, 65 MHz to 6 GHz	0 dBm ±2 dB, typical
LO OUT (RF OUT 0) power, 65 MHz to 6 GHz	0 dBm ±2 dB, typical
Output power resolution	0.25 dB, nominal
Output impedance	50 Ω, nominal, AC coupled
Output return loss	>11.0 dB (VSWR <1.8:1), typical
Output isolation (state: disabled), <2.5 GHz tuned LO	-45 dBc, nominal
Output isolation (state: disabled), ≥2.5 GHz tuned LO	-35 dBc, nominal

LO IN (RF IN 0 and RF OUT 0)

Connectors	SMA (female)
Frequency range^[36]	65 MHz to 6 GHz
Expected input power, LO IN (RF IN 0), 65 MHz to 6 GHz	0 dBm ±3 dB, nominal
Expected input power, LO IN (RF OUT 0), 65 MHz to 6 GHz	0 dBm ±3 dB, nominal
Input impedance	50 Ω, nominal, AC coupled
Input return loss	>11.7 dB (VSWR <1.7:1), typical
Absolute maximum power	+15 dBm
Maximum DC voltage	±5 VDC

REF IN

Connector	SMA (female)
Frequency	10 MHz
Tolerance^[37]	±10 × 10^-6
Square amplitude	0.7 V_pk-pk to 5.0 V_pk-pk into 50 Ω, typical
Sine amplitude^[38]	1.4 V_pk-pk to 5.0 V_pk-pk into 50 Ω, typical
Input impedance	50 Ω, nominal
Coupling	AC

REF OUT

Connector	SMA (female)
Reference Clock frequency^[39]	10 MHz, nominal
Sample Clock frequency	250 MHz, nominal
Amplitude	1.65 Vpk-pk into 50 Ω, nominal
Output impedance	50 Ω, nominal
Coupling	AC

PFI 0

Connector

SMA (female)

Table 31. Voltage Levels^[40]
Item	Level
Absolute maximum input range	-0.5 V to 5.5 V
V_IL	0.8 V
V_IH	2.0 V
V_OL	0.2 V with 100 μA load
V_OH	2.9 V with 100 μA load

Input impedance	10 kΩ, nominal
Output impedance	50 Ω, nominal
Maximum DC drive strength	24 mA
Minimum required direction change latency^[41]	48 ns + 1 clock cycle

DIGITAL I/O

Connector

VHDCI

Table 32. DIGITAL I/O Signal Characteristics
Signal	Direction	Port Width
DIO <23..20>	Bidirectional, per port	4
DIO <19..16>	Bidirectional, per port	4
DIO <15..12>	Bidirectional, per port	4
DIO <11..8>	Bidirectional, per port	4
DIO <7..4>	Bidirectional, per port	4
DIO <3..0>	Bidirectional, per port	4
PFI 1	Bidirectional	1
PFI 2	Bidirectional	1
Clock In	Input	1
Clock Out	Output	1

Table 33. Voltage Levels^[42]
Item	Level
Absolute maximum input range	-0.5 V to 4.5 V
V_IL	0.8 V
V_IH	2.0 V
V_OL	0.2 V with 100 μA load
V_OH	2.9 V with 100 μA load

Input impedance, DIO <23..0>, CLK IN	10 kΩ, nominal
Input impedance, PFI 1, PFI 2	100 kΩ pull up, nominal
Output impedance	50 Ω, nominal
Maximum DC drive strength	12 mA
Minimum required direction change latency^[43]	48 ns + 1 clock cycle
Maximum toggle rate	125 MHz, typical

Power Requirements

Table 34. Power Requirements
Voltage (V_DC)	Typical Current (A)	Maximum Current (A)
+3.3	4.7	5.4
+12	3.5	4.2
Power is 58 W, typical. Consumption is from both NI PXI Express backplane power connectors.

Calibration

Interval

1 year

Note For the two-year calibration interval, add 0.2 dB to one year specifications for Absolute Amplitude Accuracy, RF input Frequency Response, Output Power Level Accuracy, and RF output Frequency Response.

Physical Characteristics

PXIe-5646 module	3U, three slot, PXI Express module 6.1 cm × 12.9 cm × 21.1 cm(2.4 in. × 5.6 in. × 8.3 in.)
Weight	1,360 g (48.0 oz)

Environment

Maximum altitude	2,000 m (800 mbar) (at 25 °C ambient temperature)
Pollution Degree	2

Indoor use only.

Operating Environment

Ambient temperature range	0 °C to 55 °C
Relative humidity range	10% to 90%, noncondensing

Storage Environment

Ambient temperature range	-40 °C to 71 °C
Relative humidity range	5% to 95%, noncondensing

Shock and Vibration

Operating shock

30 g peak, half-sine, 11 ms pulse

Random vibration
Operating	5 Hz to 500 Hz, 0.3 g_rms
Nonoperating	5 Hz to 500 Hz, 2.4 g_rms

Compliance and Certifications

Safety Compliance Standards

This product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:

IEC 61010-1, EN 61010-1
UL 61010-1, CSA C22.2 No. 61010-1

Note For safety certifications, refer to the product label or the Product Certifications and Declarations section.

Electromagnetic Compatibility

This product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:

EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity
EN 55011 (CISPR 11): Group 1, Class A emissions
EN 55022 (CISPR 22): Class A emissions
EN 55024 (CISPR 24): Immunity
AS/NZS CISPR 11: Group 1, Class A emissions
AS/NZS CISPR 22: Class A emissions
FCC 47 CFR Part 15B: Class A emissions
ICES-001: Class A emissions

Note In the United States (per FCC 47 CFR), Class A equipment is intended for use in commercial, light-industrial, and heavy-industrial locations. In Europe, Canada, Australia, and New Zealand (per CISPR 11), Class A equipment is intended for use only in heavy-industrial locations.

Note Group 1 equipment (per CISPR 11) is any industrial, scientific, or medical equipment that does not intentionally generate radio frequency energy for the treatment of material or inspection/analysis purposes.

Note For EMC declarations, certifications, and additional information, refer to the Product Certifications and Declarations section.

Product Certifications and Declarations

Refer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for NI products, visit ni.com/product-certifications, search by model number, and click the appropriate link.

Environmental Management

NI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.

For additional environmental information, refer to the Engineering a Healthy Planet web page at ni.com/environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.

EU and UK Customers

Waste Electrical and Electronic Equipment (WEEE)—At the end of the product life cycle, all NI products must be disposed of according to local laws and regulations. For more information about how to recycle NI products in your region, visit ni.com/environment/weee.

电子信息产品污染控制管理办法（中国RoHS）

中国RoHS— NI符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。关于NI中国RoHS合规性信息，请登录 ni.com/environment/rohs_china。(For information about China RoHS compliance, go to ni.com/environment/rohs_china.)

¹ Tuning resolution combines LO step size capability and frequency shift DSP implemented on the FPGA.

² Medium loop bandwidth is available only in fractional mode.

³ Conditions: Measured Port: LO OUT; Reference Clock: internal; medium loop bandwidth.

⁴ Conditions: Measured Port: LO OUT; Reference Clock: internal.

⁵ Constant LO frequency, constant RF input signal, varying input reference level.

⁶ LO tuning across harmonic filter bands, constant RF input signal, varying input reference level.

⁷ dBr is relative to the full scale of the configured RF reference level.

⁸ Conditions: VSA frequency range 109 MHz to 6 GHz. Measurement performed after self-calibration.

⁹ Measurement performed after self-calibration.

¹⁰ Conditions: Two -10 dBm tones, 700 kHz apart at RF IN; reference level: -2 dBm; nominal noise floor: -145 dBm/Hz.

¹¹ Higher output is uncalibrated and may be compressed.

¹² Up to 12 dB crest factor, based on 3GPP LTE uplink requirements.

¹³ Average output power ≥ -100 dBm.

¹⁴ Constant LO frequency, varying RF output power range. Power levels ≤ 0 dBm. 175 μs for power levels > 0 dBm.

¹⁵ LO tuning across harmonic filter bands.

¹⁶ Harmonic suppression is reduced in this frequency range. As a result, offset errors may occur depending on whether you are using a true RMS device, such as a power meter.

¹⁷ Measured using 1 MHz baseband signal -1 dBFS; fundamental signal measured at +6 dBm CW.

¹⁸ Measurement performed after self-calibration.

¹⁹ Measurement performed after self-calibration.

²⁰ Conditions: EVM signal: 20 MHz bandwidth; 64 QAM signal. Pulse-shape filtering: root-raised-cosine, alpha=0.25; PXIe-5646 reference level: -10 dBm; Reference Clock source: internal; record length: 300 μs. Generator: PXIe-5673; power (average): -14 dBm; Reference Clock source: internal.

²¹ Conditions: 20 MHz bandwidth, 64 QAM; centered at LO frequency or offset digitally as listed.

²² Conditions: EVM signal: 20 MHz bandwidth; 64 QAM signal. Pulse-shape filtering: root-raised cosine, alpha=0.25; PXIe-5646 peak output power: -10 dBm; Reference Clock source: internal. Measurement instrument: PXIe-5665; reference level: -10 dBm; Reference Clock source: internal; record length: 300 μs.

²³ Conditions: 20 MHz bandwidth, 64 QAM; centered at LO frequency or offset digitally as listed.

²⁴ Conditions: RF OUT loopback to RF IN; 5,800 MHz; average power: -30 dBm to -5 dBm; 20 packets; 16 OFDM data symbols; MCS=9; 256 QAM.

²⁵ Conditions: RF OUT loopback to RF IN; 2,412 MHz; 20 MHz bandwidth; average power -10 dBm; reference level: auto-leveled based on real-time average power measurement; averages: 10; pulse-shaping filter: Gaussian reference; CCK 11 Mbps.

²⁶ Single channel uplink only.

²⁷ Conditions: DL Test Model 1 (64DPCH); RF output level: -10 dBm average; RF OUT loopback to RF IN; measured results better than -65 dB.

²⁸ ADCs are dual-channel components with each channel assigned to I and Q, respectively.

²⁹ I/Q data rates lower than 250 MS/s are achieved using fractional decimation.

³⁰ DACs are dual-channel components with each channel assigned to I and Q, respectively. DAC sample rate is internally interpolated to 1 GS/s, automatically configured.

³¹ I/Q data rates lower than 250 MS/s are achieved using fractional interpolation.

³² For modulated signals, peak instantaneous power not to exceed +36 dBm.

³³ For modulated signals, peak instantaneous power not to exceed corresponding peak power of specified CW.

³⁴ For modulated signals, peak instantaneous power not to exceed corresponding peak power of specified CW.

³⁵ When tuning to 65 MHz to 375 MHz using the RF IN channel, the exported LO is twice the RF frequency requested.

³⁶ When tuning to 65 MHz to 375 MHz using the RF IN channel, the exported LO is twice the RF frequency requested.

³⁷ Frequency Accuracy = Tolerance × Reference Frequency

³⁸ 1 V RMS to 3.5 V RMS, typical. Jitter performance improves with increased slew rate of input signal.

³⁹ Refer to the Internal Frequency Reference for accuracy.

⁴⁰ Voltage levels are guaranteed by design through the digital buffer specifications.

⁴¹ Clock cycle refers to the FPGA clock domain used for direction control.

⁴² Voltage levels are guaranteed by design through the digital buffer specifications.

⁴³ Clock cycle refers to the FPGA clock domain used for direction control.

In This Section

Definitions
Conditions
Frequency
- Frequency Settling Time
- Internal Frequency Reference
- Frequency Reference Input (REF IN)
- Frequency Reference/Sample Clock Output (REF OUT)
- Spectral Purity
RF Input Amplitude Range
RF Input Amplitude Settling Time
RF Input Absolute Amplitude Accuracy
RF Input Frequency Response
RF Input Average Noise Density
RF Input Nonharmonic Spurs
RF Input LO Residual Power
RF Input Residual Sideband Image
RF Input Third-Order Intermodulation
RF Input Second-Order Intermodulation
RF Output Power Range
RF Output Amplitude Settling Time
RF Output Power Level Accuracy
RF Output Frequency Response
RF Output Noise Density
RF Output Harmonics
RF Output Nonharmonic Spurs
RF Output Third-Order Intermodulation
RF Output LO Residual Power
RF Output Residual Sideband Image
VSA EVM
VSG EVM
Application-Specific Modulation Quality
- WLAN 802.11ac
- WLAN 802.11n
- WLAN 802.11a/g/j/p
- WLAN 802.11g
- WLAN 802.11b/g
- LTE
- WCDMA
Baseband Characteristics
- Onboard FPGA
- Onboard DRAM
- Onboard SRAM
Front Panel I/O
- RF IN
- RF OUT
- CAL IN, CAL OUT
- LO OUT (RF IN 0 and RF OUT 0)
- LO IN (RF IN 0 and RF OUT 0)
- REF IN
- REF OUT
- PFI 0
- DIGITAL I/O
Power Requirements
Calibration
Physical Characteristics
Environment
- Operating Environment
- Storage Environment
Shock and Vibration
Compliance and Certifications
- Safety Compliance Standards
- Electromagnetic Compatibility
- Product Certifications and Declarations
- Environmental Management

Related Information

Refer to the Considering Average Power and Crest Factor topic of the NI RF Vector Signal Transceivers Help for more information about modulated signal power.

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